This product was developed by SUMITOMO SEIKA CHEMICALS from epoxy compounds and carbon dioxide using ring-opening polymerization technology. Owning to its unique properties, it can be used in application development of binders for ceramics and other materials, and modified resins.
The thermal decomposition behavior (programming rate: 10°C/min.) of APC under an air atmosphere and nitrogen atmosphere are as shown in the graphs below.
In both cases, APC begins to decompose at around 230°C and finishes at 320°C to 380°C. The amount of the decomposition residue is extremely small.
The decomposition gases under an air atmosphere are water and carbon dioxide, which have extremely little influence on the calcination product.
APC can be used as a binder for metallic pastes, ceramics, etc.
2. Modification of polyolefin resins
By adding APC to polyolefin, high strength and stretchability of the polyolefin can be obtained under high-speed stretching.
This improves the impact resistance of polyolefin. (Joint research with Kanazawa University)